不能说的秘密

财联社8月24日讯（编辑 马兰）人工智能数据中心使用的高带宽内存（HBM）技术正在出现重大转向。SK海力士美国公司副总裁Lee Jae-sik最新表示，未来行业不仅需要关注HBM本身，还需要关注封装技术如何影响HBM。Lee在当地时间23日出席了美国斯坦福大学举行的半导体会议Hot Chips 2026，并发表了题为“HBM的高科技封装”演讲。他表示，在人工智能半导体时代，为了确保竞争力，不仅HBM本身的性能需要优化，GPU、封装和代工工艺也必须进行优化。    Aryan Khan has once again landed in trouble after a complaint was filed against him for flashing his middle finger at a crowd during an event in Bengaluru on November 28. Advocate Owaiz Hussain S, a resident of Sankey Road, submitted a complaint to the Director General of Police, the Bengaluru City Police Commissioner, The DCP, the Inspector of Cubbon Park Police Station, and the Karnataka State Women's Commission and sought the registration of an FIR against Shah Rukh Khan's son.          Owaiz claimed that Aryan's gesture was obscene and mentioned in his complaint that since several women were present at the venue, he 'insulted their modesty'. He also claimed that the gesture of showing his middle finger caused public discomfort, embarrassment, emotional distress and alleged that it reflected poorly on Bengaluru as a 'safe and dignified public environment.' The video, now viral on social media, shows Aryan casually flashing his middle finger, seemingly as a playful gesture directed at his friends in the crowd. It appeared to be light-hearted banter among friends.     Meanwhile, netizens reacted to the complaint with disbelief, questioning why such a trivial gesture would warrant legal action.     Lol someone actually filed a complaint against Aryan khan for this! byu/arina_0730 inBollyBlindsNGossip                    One user wrote on Reddit, "Never knew lawyers had free time to complain about his actions instead of focusing on major issues that result in far more serious cases", while another one added, "Also just found out that it was his private event with friends, not even a public event, contrary to what the lawyer claims."     Commenting along the same lines, another netizen shared, "This stupid complaint caused me discomfort. Can I file a complaint against it?"     "Judge should fine the complainant for wasting courts time," added another user. The case is currently under investigation under Section 173 B of the Bharatiya Nyaya Sanhita.     Also Read: Photos: Shah Rukh Khan Teases a Raw and Rugged Look in Aryan Khan’s New Video。目前，SK海力士的HBM采用三维堆叠式设计，通过硅通孔将多个核心芯片连接到一个基底芯片上。

B | HBM目前最高可达16层堆叠。

C | 封装技术则采用了MR+MUF（回流焊+注塑底部填充）。相比于TC+NCF（热压+非导电薄膜），MR+MUF生产效率更高，热阻更低，但更容易发生芯片翘曲，并且存在间隙填充方面的不足。但SK海力士结合了翘曲控制和精细间距集成及窄间隙填充新技术，成功提高了现有HBM的性能。SK海力士还在开发混合键合封装技术，以实现超越16层堆叠的20层或更多层的目标。

D | 该技术可在相同高度下将核心芯片厚度增加高达24%，并通过消除现有微凸点并直接连接芯片，将凸点间距缩小至18微米以下。

E | 此外，该技术有望通过更高效的散热来减少发热问题。

携手优化的时代与现有存储器不同，HBM在人工智能半导体中首先被组装到中介层上。Lee指出，过去存储器是在系统组装的最后阶段安装的，但在人工智能时代截然不同，这要求HBM的可靠性更加重要。他补充称，HBM必须承受后续工艺中产生的热量和机械应力，因此与客户进行联合开发至关重要。这也意味着，内存厂商、GPU设计商、代工厂和封装厂商必须从一开始就进行协同设计。SK海力士还在会上发布了一项用于冷却HBM内部特定区域“热点”的技术。Lee表示，HBM的输入/输出速度越快，热量就越集中在某些区域。

F | 正在开发的iHBM技术通过添加耐高温导热材料，只对热量集中的区域进行集中冷却，而非对整个HBM进行冷却。他还指出，HBM的带宽和容量未来将继续增长，但发热、功耗和封装将成为更大的挑战，这要求客户、代工厂和封装公司必须携手优化。